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Package for High Speed Circuits

IP.com Disclosure Number: IPCOM000069440D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Braslau, N Keyes, RW [+details]

Abstract

Removable connection circuit packaging, wherein pin contact is made through a deformable conducting member, such as a drop of mercury, can have the mutual coupling between pins reduced, the inductive delay reduced and line discontinuities reduced by providing GROUND PLANE conductivity capability for the packaging substrate, and electrical transmission line parameter control between the signal lines and signal pins, and the conductivity capability of the substrate.