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Individualization of Bubble Device Overlay Properties

IP.com Disclosure Number: IPCOM000069461D
Original Publication Date: 1978-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Powers, JV [+details]

Abstract

In the fabrication of bubble devices, the coercivity of permalloy used to move bubble domains is often a function of underlays onto which the permalloy is deposited. NiP is one such underlay. It has been found that the coercivity of permalloy on a NiP underlay will depend on the thickness of the underlay, for thicknesses up to about 800 angstroms, if the following bath is used for plating of the underlayer.