Browse Prior Art Database

Module Housing

IP.com Disclosure Number: IPCOM000069494D
Original Publication Date: 1978-May-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Ernst, LM McCollum, WE Wilzbach, BL [+details]

Abstract

A molded module base includes multiple interconnected recesses for receiving circuit element assemblies, with the module being inexpensively sealable and adapted to printed-circuit card mounting.