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A molded module base includes multiple interconnected recesses for receiving circuit element assemblies, with the module being inexpensively sealable and adapted to printed-circuit card mounting.
English (United States)
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A molded module base includes multiple interconnected recesses for
receiving circuit element assemblies, with the module being inexpensively
sealable and adapted to printed-circuit card mounting.
The main body of module 10 is molded with groups of recessed openings,
such as groups 11 and 12. Each group 11 and 12 includes multiple chambers
with interconnecting openings to accept a prefabricated component assembly,
such as 15. Module 10 is symmetrical in that groups similar to 11 and 12 are
included on the opposite side. Covers 18 and 20 are configured to be attached
over both sides of module 10 and can be bolted in place, ultrasonically bonded to
the housing or the like. Alternatively, covers 18 and 20 can be omitted, and the
component assemblies potted in the recessed groups.
Slot 25 allows attachment of module 10 to a circuit card 26 (shown in
phantom). Circuit card 26 is preferably notched to receive housing 10 via slot 25.
External electrical communications are by edge connection in conjunction with
slot 25 or through auxiliary openings, such as 28, or externally accessed through
any suitable arrangement. The outer peripheral configuration of module 10 is
configured so as to fit within the interior walls of a housing box or the like (not
shown), and can be generally square in cross-section, as shown, circular in
cross-section, or in any suitable configuration to fit within the container, but still
be slidably removable with board 26. The module...