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IC Package Assembly Disclosure Number: IPCOM000069511D
Original Publication Date: 1978-May-01
Included in the Prior Art Database: 2005-Feb-20

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Larnerd, JD [+details]


Circuitized high temperature polyimide laminate or film 1 (Fig. 1) is fabricated with an interwoven material having a low thermal expansion coefficient, e.g., quartz or KEVLAR*. The resultant composite expansion coefficient matches that of the silicon integrated circuit (IC) chip to which it is bonded.