Browse Prior Art Database

IC Package Assembly

IP.com Disclosure Number: IPCOM000069511D
Original Publication Date: 1978-May-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Larnerd, JD [+details]

Abstract

Circuitized high temperature polyimide laminate or film 1 (Fig. 1) is fabricated with an interwoven material having a low thermal expansion coefficient, e.g., quartz or KEVLAR*. The resultant composite expansion coefficient matches that of the silicon integrated circuit (IC) chip to which it is bonded.