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LSI Cooling Technique Disclosure Number: IPCOM000069524D
Original Publication Date: 1978-May-01
Included in the Prior Art Database: 2005-Feb-20

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Related People

Cases, M Rubin, BJ Wu, LL [+details]


A proposed silicon chip cooling scheme is shown schematically in the diagram. It illustrates an arrangement of logic chip(s) and associated cooling elements. The heat is transferred from the chip(s) via the mercury dot(s) to the cooling block (or module cap), and then to the cooling wafer. Mercury is chosen as the transfer agent because of its good heat conductivity. Also, because of the fluidity of mercury, the stress on the chip(s) is considerably reduced.