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Resistor on MLC Enhancement

IP.com Disclosure Number: IPCOM000069525D
Original Publication Date: 1978-May-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
VanHise, JA [+details]

Abstract

Multilayer ceramic (MLC) technology has process steps and product uniqueness which must be overcome to be successful in applying thick films to the MLC substrate. The problems which must be overcome are as follows: 1. The top surface metallurgy (TSM) and bottom surface metallurgy (BSM) of the MLC substrate are molybdenum overplated with nickel and gold. Subsequent process steps, such as pin joining to the substrate by brazing, and chip joining require reducing process atmospheres to maintain the integrity of this metallurgy. Thick film technology requires oxidizing atmospheres. Therefore, a basic process incompatibility exists between the marriage of thick films to the MLC substrate. 2.