Browse Prior Art Database

Multilayer Module

IP.com Disclosure Number: IPCOM000069526D
Original Publication Date: 1978-May-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Fedrowitz, W Narken, B [+details]

Abstract

In the semi-exploded view shown, individual layers are made using a suitable glass in the form of microsheet (thickness 50 mu m to 250 Mu m) as a structural dielectric onto which conductors (copper) are deposited and vias (solder) for connectability between layers. Each layer can be completely tested before being assembled in a multilayer structure. Interstitial heat conducting plates (copper), which also serve as ground planes, allow large-area heat dissipating air cooling. Chips are mounted with their back against a massive via directly attached to a massive cooling plate leading to a large-area air-cooled fin. All layers are mechanically aligned, and rework or replacement of any layer is possible.