Browse Prior Art Database

Semiconductor Module with Heat Transfer Disclosure Number: IPCOM000069541D
Original Publication Date: 1978-May-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue


Related People

Eckenbach, H Krumrein, W Tandjung, H [+details]


A typical semiconductor module consists of a ceramic substrate with connectors and conductors, onto which semiconductor chips are soldered via solder balls. This arrangement is encapsulated in a metal cap. The heat transfer capacity is increased by a thermally conductive connection between the chips and the metal cap.