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Semiconductor Module with Heat Transfer

IP.com Disclosure Number: IPCOM000069541D
Original Publication Date: 1978-May-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Eckenbach, H Krumrein, W Tandjung, H [+details]

Abstract

A typical semiconductor module consists of a ceramic substrate with connectors and conductors, onto which semiconductor chips are soldered via solder balls. This arrangement is encapsulated in a metal cap. The heat transfer capacity is increased by a thermally conductive connection between the chips and the metal cap.