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This article describes a method of transferring metallurgy and dielectric materials to form via columns consisting of conductors, resistors and capacitors in ceramic materials and substrates.
English (United States)
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This article describes a method of transferring metallurgy and dielectric
materials to form via columns consisting of conductors, resistors and capacitors
in ceramic materials and substrates.
During normal personalization of ceramic packages, green sheets are first
punched with via holes, after which the sheets are screened with metallurgical
paste forming through vias and planar personalization. In screening via holes,
particularly ones having large diameters and those formed in thick green sheets,
large voids or severe cupping takes place.
The transfer personalization involves transferring metallurgy into a via or onto
the green sheet surface. Referring to Fig. 1 (before), the green sheet 10 has a
pattern of holes 11 punched therein. A metal die 12 having openings 14 therein,
corresponding to the green sheet 10 hole pattern, is placed over the punched
green sheet 10 so that the holes are aligned. A previously cast metallurgical
green sheet 16 is then placed over the punch die 12, and the via pattern is
punched in the metallurgical green sheet 16 by punch 9. The slugs 18 from the
metallurgical green sheet 16 are transferred through the die openings 14 into the
green sheet 10 material below, as shown in Fig. 1 (after). The via column can
be provided at the base of the green sheet 10 by including a supporting pin or
punch 20 in the regular die set. This allows some compaction when necessary to
obtain spreading and lock the slug 18 into the...