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Producing Uniform Nozzle Orifices in Silicon Wafers

IP.com Disclosure Number: IPCOM000069590D
Original Publication Date: 1978-May-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Kurth, RH [+details]

Abstract

This method for producing nozzle plates for ink jet recording is practical for etching through silicon wafers which frequently are nonuniform in thickness.