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Permalloy Solder Barrier for Devices with Gold Conductor Metallization Disclosure Number: IPCOM000069597D
Original Publication Date: 1978-May-01
Included in the Prior Art Database: 2005-Feb-21

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Related People

Ahn, J Chiou, C Duke, P Montelbano, T [+details]


The controlled collapse chip connection (C4) process is used to connect functional chips to a module. The problems associated with this process when the chips have gold conductors thereon are substantially reduced by the use of a thin layer of a permalloy-type material positioned on the gold conductors and beneath the glass passivation layer.