Browse Prior Art Database

Permalloy Solder Barrier for Devices with Gold Conductor Metallization

IP.com Disclosure Number: IPCOM000069597D
Original Publication Date: 1978-May-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue

IBM

Related People

Authors:
Ahn, J Chiou, C Duke, P Montelbano, T [+details]

Abstract

The controlled collapse chip connection (C4) process is used to connect functional chips to a module. The problems associated with this process when the chips have gold conductors thereon are substantially reduced by the use of a thin layer of a permalloy-type material positioned on the gold conductors and beneath the glass passivation layer.