Permalloy Solder Barrier for Devices with Gold Conductor Metallization
Original Publication Date: 1978-May-01
Included in the Prior Art Database: 2005-Feb-21
The controlled collapse chip connection (C4) process is used to connect functional chips to a module. The problems associated with this process when the chips have gold conductors thereon are substantially reduced by the use of a thin layer of a permalloy-type material positioned on the gold conductors and beneath the glass passivation layer.