Mounting Technique for Solder Reflow Areal Array Mounted Silicon Chips Which Allows Direct and Efficient Backside Heat Removal
Original Publication Date: 1978-May-01
Included in the Prior Art Database: 2005-Feb-21
The problem of expansion mismatch and resulting structural failure can be alleviated and still allow efficient conductive heat removal in semiconductor packaging through the use of a mutual carrier member that supports both the chip and a cooling stud, as shown in Fig. 1. The key feature is the use of support and electrical solder reflow contacts that have the same thermal expansion coefficients. The support solder reflow contacts can be Pb-Sn or Pb-Tn solder.