Browse Prior Art Database

Water Soluble Flux

IP.com Disclosure Number: IPCOM000069695D
Original Publication Date: 1978-Jun-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue

IBM

Related People

Authors:
Owen, CJ Poliak, RM Rivenburgh, DL [+details]

Abstract

Water-soluble flux compositions which leave no insoluble residue on pins, which do not require excessive flux cleaning or a flux quench after tinning and which employ high temperature solvents to maintain a solder film at higher soldering temperature, have the following general composition: % by Weight Dimethylamine: HCL 1.0 +/- 0.5 Distilled Water 12.0 +/- 8.0 Isopropyl Alcohol 21.9 +/- 10.0 Butyl CELLOSOLVE* 21.0 +/- 10.0 Polyethylene Glycol-400 44.0 +/- 10.0 Fluorocarbon Surfactant (FC-134)** 0.1 +/- 0.01 A specific formulation is: % by Weight Dimethylamine: HCL 1.0 +/- .05 Distilled Water 12.0 +/- 0.