Browse Prior Art Database

Flanged Pin MC Substrate Design,

IP.com Disclosure Number: IPCOM000069698D
Original Publication Date: 1978-Jun-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue

IBM

Related People

Authors:
Funari, J Myers, FR Thomson, WG [+details]

Abstract

The present design relates to pin bonding using welding on metallized ceramic (MC) substrates. Pins which are provided with a flange head or shoulder can be bonded on the MC substrate without heating the substrate using a special welding process. Bonding material at up to 1500 degrees F can be used between the pin flange and substrate land. One important advantage of this method is the provision of hermetically sealing the hole between the pin and the substrate.