Technique to Minimize Device Pad Bulge during Sintering of MLC Module
Original Publication Date: 1978-Jun-01
Included in the Prior Art Database: 2005-Feb-21
It has been noted that during sintering of a multilayer ceramic (MLC) module, there occurs a perceptible upward bulge in areas where closely spaced vias are provided, for example, the pad terminals for joining a device to the module. This upward bulging of the device pad area adversely affects the integrity of the solder bonds of a device joined by flip-chip bonding techniques.