Browse Prior Art Database

Heat Conductor Module

IP.com Disclosure Number: IPCOM000069719D
Original Publication Date: 1978-Jun-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue

IBM

Related People

Authors:
Hwang, UP Spector, CJ [+details]

Abstract

The internal thermal resistance of the module shown is almost zero. The semiconductor chip 1 is eutectically bonded to a finned-molybdenum stud 2. The semiconductor chip 1 is connected to a multilayer ceramic substrate 3 by flying leads or beam leads 4. A protective cap 5 covers these interconnections. Input output pins 6 connect the substrate 3 to a board 7.