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Mesa MLC Substrate Construction

IP.com Disclosure Number: IPCOM000069720D
Original Publication Date: 1978-Jun-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue

IBM

Related People

Authors:
VanHise, JA [+details]

Abstract

To reduce the cost of multilayer ceramic (MLC) substrates, a mesa-like construction of the substrate is proposed. A major cost element in the fabrication of MLC substrates is the cost of the personalized green sheets. These sheets make up the individual layers.of the substrate. The more repeating patterns or "upa" which cam be personalized on the green sheet at the same time, the lower the substrate cost will be. Usually the green sheet "ups" (which are analogous to dice on a semiconductor wafer) are dictated by the I/O layers of the MLC substrate design.