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Stressed Reduced Conductive Vias

IP.com Disclosure Number: IPCOM000069722D
Original Publication Date: 1978-Jun-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue

IBM

Related People

Authors:
Kumar, AH Miller, LF [+details]

Abstract

High stresses resulting from the thermal expansion mismatches between metals and ceramics, can cause unwanted cracks between metal-filled vias in multilayer ceramic circuit modules. These high stresses and via-via cracks are undesirable.