Browse Prior Art Database

Reworkable Cover Plate for Semiconductor Device Packages

IP.com Disclosure Number: IPCOM000069723D
Original Publication Date: 1978-Jun-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue

IBM

Related People

Authors:
Hannan, JJ Shapiro, MR Walker, WJ [+details]

Abstract

In the more sophisticated semiconductor packages it is occasionally necessary to remove the element enclosing the semiconductor devices mounted on a substrate in order to replace the devices due to failure or to make engineering changes and circuit repairs.