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Substrate Electrode Paste

IP.com Disclosure Number: IPCOM000069736D
Original Publication Date: 1978-Jun-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue

IBM

Related People

Authors:
DiGiacomo, G Gniewek, JJ Rizzuto, JB [+details]

Abstract

A potential problem with Ag/Pd electrode pastes is sulfide corrosion of silver-rich regions which form when the solder reacts with the fired paste. This electrode paste has improved corrosion resistance to sulfides. This paste has a conductive metal powder of the following composition: Palladium 10-25% By Weight % by weight should have a tolerance Gold 15-35% By Weight equal to that allowed by our Silver 50-75% By Weight formulation and process.