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Packaging Structure Disclosure Number: IPCOM000069744D
Original Publication Date: 1978-Jun-01
Included in the Prior Art Database: 2005-Feb-21

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Blake, BE Druschel, WO Metreaud, CG [+details]


A poor cooling environment is typical of certain applications for multilevel ceramic (MLC) modules. The problem is usually aggravated by the lack of a cooling fan. As illustrated by Fig. 2, a planar board (or card) is mounted horizontally in a dead air space in a typewriter structure. For various reasons, the use of a cooling fan is precluded, and natural cooling is entirely inadequate to cool the module. The solution offered by this article is to provide a means for the conductive cooling of the module. A flexible conductive strap (a) is attached between the module (b) and one of the machine structural elements (c) acting as a suitable heat sink. The attachment of the strap to the module is depicted in Figs. 3 and 4.