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Laser Connection and Disconnection Scheme

IP.com Disclosure Number: IPCOM000069786D
Original Publication Date: 1978-Jun-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue

IBM

Related People

Authors:
Wu, WW [+details]

Abstract

The scheme shown above requires only one laser shot to make a connection between two conductives lines 10 and 12 on a silicon layer 14 of a monolithic chip. The lines 10 and 12 end in two closely juxtapositioned, but initially isolated, lands 16 and 18. Directly over these lands and under the silicon dioxide layer is a metal square 20. The two lands 16 and 18 in the square form the laser target. When this target is hit by the laser beam, the two lands 16 and 18 become welded to the metal square 20 to make a connection between the two lines 10 and 12. The metal square acts as an energy barrier, preventing the laser energy from penetrating into the bulk of the silicon underneath the square.