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Aluminum Deposition With Good Step Coverage

IP.com Disclosure Number: IPCOM000069850D
Original Publication Date: 1978-Jun-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue

IBM

Related People

Authors:
Silvestri, VJ [+details]

Abstract

When conducting lines are formed on a substrate by the evaporation of aluminum, voids often occur at the surface steps between the horizontal substrate and the vertical sides of the lines because of the shadowing of the normally unidirectional deposition of the aluminum.