Browse Prior Art Database

MLC Expander

IP.com Disclosure Number: IPCOM000069892D
Original Publication Date: 1978-Jul-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue

IBM

Related People

Authors:
Gow, J Stephans, E [+details]

Abstract

It is well known that integrated circuit chips can be mounted on substrates fabricated from metalized ceramic or multilayer ceramic (MLC) utilizing small solder balls. The characteristics of metalized ceramic differ greatly from the characteristics of metalized multilayer ceramic.