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MLC Expander Disclosure Number: IPCOM000069892D
Original Publication Date: 1978-Jul-01
Included in the Prior Art Database: 2005-Feb-21

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Gow, J Stephans, E [+details]


It is well known that integrated circuit chips can be mounted on substrates fabricated from metalized ceramic or multilayer ceramic (MLC) utilizing small solder balls. The characteristics of metalized ceramic differ greatly from the characteristics of metalized multilayer ceramic.