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Joining a Panel to Features Printed on the Surface of a Substrate

IP.com Disclosure Number: IPCOM000069918D
Original Publication Date: 1978-Jul-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue

IBM

Related People

Authors:
Arnold, AJ Coughlin, CP Hardin, PW [+details]

Abstract

Depicted above is a method for joining a panel with through holes (such as a multilayer printed circuit) to features printed on the unbroken surface of another panel (such as a multilayer ceramic substrate) by means of solder clad studs which simultaneously capture the two panels by reflow of the solder cladding.