Browse Prior Art Database

Two Stage Module Seal

IP.com Disclosure Number: IPCOM000069939D
Original Publication Date: 1978-Jul-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue

IBM

Related People

Authors:
Arnold, AJ Robbins, GJ Siwy, MJ [+details]

Abstract

The structure shown above depicts a method of capping and sealing an electronic assembly whose interior contains a corrosive thermal medium, such as GaIn. To achieve a durable package, dual complementary seals are employed.