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Two Stage Module Seal Disclosure Number: IPCOM000069939D
Original Publication Date: 1978-Jul-01
Included in the Prior Art Database: 2005-Feb-21

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Arnold, AJ Robbins, GJ Siwy, MJ [+details]


The structure shown above depicts a method of capping and sealing an electronic assembly whose interior contains a corrosive thermal medium, such as GaIn. To achieve a durable package, dual complementary seals are employed.