Browse Prior Art Database

Chip Cooling Package

IP.com Disclosure Number: IPCOM000069940D
Original Publication Date: 1978-Jul-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue

IBM

Related People

Authors:
Bhattacharya, S Sullivan, EJ [+details]

Abstract

Shown in Fig. 1 is a cooling system for a semiconductor package, as described in the IBM Technical Disclosure Bulletin 20, 1120-1121 (August 1977).