Browse Prior Art Database

Air Cooled Chip Conduction Module

IP.com Disclosure Number: IPCOM000070009D
Original Publication Date: 1978-Jul-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue

IBM

Related People

Authors:
Gupta, OR [+details]

Abstract

The arrangement provides for air coolability of high power chips 10 which are solder-ball 9 connected to the substrate 14. A direct thermal path is provided from the chip to the air stream. A spring-loaded piston 11 slides in a cylinder 12 and maintains a controlled annulus therebetween. The piston makes good contact with the chip 10. The module has air space between the substrate 14 and the housing 15. The cylinder 12 extends well into the air stream. A plurality of fins 16 are fabricated on the outside of the cylinder 12, as shown in Fig. 1. This arrangement provides a direct thermal path to the large number of external surfaces to provide heat transfer by convection into the air stream.