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This arrangement provides thermally conductive paths from hot to cold modules and an enhanced heat transfer surface to lower all temperatures and provide a more uniform temperature distribution.
English (United States)
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This arrangement provides thermally conductive paths from hot to cold
modules and an enhanced heat transfer surface to lower all temperatures and
provide a more uniform temperature distribution.
In conventional air-cooled modules 10 on cards 12, it is not uncommon to
have very high powered modules 14 intermingled with lower powered modules
10, resulting in substantial differences in junction temperatures of communicating
circuits. The thermal path between adjacent modules is enhanced by the
application of a thermal coupler 16 (Fig. 1). The heat from a high power module
14 will flow from the associated can into the thermal coupler 16 and along the
coupler towards lower powered modules 10. The thermal coupler 16 is
fabricated from a high thermal conductivity metal. Corrugated ribs 18 are
provided on the thermal coupler 16 to provide increased surface area and
increased air turbulence for a better heat transfer coefficient. Fig. 1 shows a
thermal coupler 16 having a corrugated or wavy fin 18 extending length wise with
respect to the direction of air flow.
Fig. 3 shows a thermal coupler removed from the modules, and Fig. 4
shows a coupler having a transverse turbulence causing rib 22 extending at right
angles to the direction of air flow. Both thermal couplers (Figs. 3 and 4) have
tabs 20 along the edges which are designed like leaf springs to provide a simple,
but reliable, means to attach to a module with good thermal contact. Thus, the