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Thermal Coupler Disclosure Number: IPCOM000070010D
Original Publication Date: 1978-Jul-01
Included in the Prior Art Database: 2005-Feb-21

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Antonetti, VW Chu, RC Moran, KP Simons, RE [+details]


This arrangement provides thermally conductive paths from hot to cold modules and an enhanced heat transfer surface to lower all temperatures and provide a more uniform temperature distribution.