Browse Prior Art Database

Thermal Coupler

IP.com Disclosure Number: IPCOM000070010D
Original Publication Date: 1978-Jul-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue

IBM

Related People

Authors:
Antonetti, VW Chu, RC Moran, KP Simons, RE [+details]

Abstract

This arrangement provides thermally conductive paths from hot to cold modules and an enhanced heat transfer surface to lower all temperatures and provide a more uniform temperature distribution.