Browse Prior Art Database

Conduction Cooling

IP.com Disclosure Number: IPCOM000070011D
Original Publication Date: 1978-Jul-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue

IBM

Related People

Authors:
Chu, RC [+details]

Abstract

In those situations where the chip or chips may not be perfectly level because the solder ball connection to the substrate causes a tilt of the chip, the usual conduction scheme requires helium gas in the interface gap to provide a low thermal resistance in the junctions. This high thermal resistance between pistons and chips due to chip tilting is overcome by utilizing a hemispherically shaped thermal conductor made of high thermal conductivity material, such as copper or aluminum.