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Conduction Cooling

IP.com Disclosure Number: IPCOM000070012D
Original Publication Date: 1978-Jul-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue

IBM

Related People

Authors:
Chu, RC [+details]

Abstract

Fig. 1 shows a thermal conduction module consisting of a chip 11 which is attached to a substrate 12 via solder balls 14. The surface of the chip 11 is contacted by a piston 16 which is spring loaded to provide the force for a good thermal contact. The piston fits within a cylinder 18 with a very small gap 20 therebetween. It should be appreciated that any tilt of the chip 11 will interfere with the seating of the piston 16 against the chip surface, thus providing an undesired gap and consequently poor heat transfer.