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Heat Transfer Process for High Thermal Input Processes

IP.com Disclosure Number: IPCOM000070053D
Original Publication Date: 1978-Jul-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue

IBM

Related People

Authors:
Cuomo, JJ [+details]

Abstract

High rate sputter deposition processes will input a high thermal load to nonthermally contacted surfaces. For example, high deposition rate of material on an isolated wire will cause intense heating to occur with the resulting problem of removing this heat.