Browse Prior Art Database

Fabrication of Intricately Shaped Cavities by Electrical Discharge

IP.com Disclosure Number: IPCOM000070056D
Original Publication Date: 1978-Jul-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue

IBM

Related People

Authors:
Anacker, W [+details]

Abstract

The present article relates to a method of forming microsockets which consist of cavities in a silicon wafer which are wider at the center than at the surfaces of the wafer. The cavities are designed to retain a liquid metal, such as mercury.