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Fabrication of Intricately Shaped Cavities by Electrical Discharge Disclosure Number: IPCOM000070056D
Original Publication Date: 1978-Jul-01
Included in the Prior Art Database: 2005-Feb-21

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Anacker, W [+details]


The present article relates to a method of forming microsockets which consist of cavities in a silicon wafer which are wider at the center than at the surfaces of the wafer. The cavities are designed to retain a liquid metal, such as mercury.