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Seeding Copper Foil Before Lamination

IP.com Disclosure Number: IPCOM000070094D
Original Publication Date: 1978-Aug-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue

IBM

Related People

Authors:
Canestaro, MJ [+details]

Abstract

It is common practice to apply a seeder or catalyze a surface upon which one desires to additively plate. The technique described below insures that the seeder adhere to the surface on which one desires to additively plate.