Browse Prior Art Database

Bonding and Rework System

IP.com Disclosure Number: IPCOM000070096D
Original Publication Date: 1978-Aug-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue

IBM

Related People

Authors:
Sjostrom, WJ Taylor, RC Warren, RK [+details]

Abstract

Infrared (IR) heat source 1 (Fig. 1) focuses an IR ray 2 obliquely incident to the workpiece W, e.g., an integrated circuit (IC) chip, which is solder-mounted to a substrate S. The resultant IR heat is substantially concentrated and confined within the elliptically shaped IR spot 3, thereby permitting a highly localized rework operation for removing and/or mounting IC chips, such as might be encountered in the field. Accordingly, it obviates the necessity of removing, i.e., dismantling, the substrate from the installation.