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Bonding and Rework System Disclosure Number: IPCOM000070096D
Original Publication Date: 1978-Aug-01
Included in the Prior Art Database: 2005-Feb-21

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Sjostrom, WJ Taylor, RC Warren, RK [+details]


Infrared (IR) heat source 1 (Fig. 1) focuses an IR ray 2 obliquely incident to the workpiece W, e.g., an integrated circuit (IC) chip, which is solder-mounted to a substrate S. The resultant IR heat is substantially concentrated and confined within the elliptically shaped IR spot 3, thereby permitting a highly localized rework operation for removing and/or mounting IC chips, such as might be encountered in the field. Accordingly, it obviates the necessity of removing, i.e., dismantling, the substrate from the installation.