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This device removal tool provides a method of removing defective chips and capacitors from metallized ceramic substrates.
English (United States)
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Device Removal Tool for MC Substrates
This device removal tool provides a method of removing defective chips and
capacitors from metallized ceramic substrates.
As shown in Fig. 1, the tool contains a support base, device clips and clip
rods. The device clips are small contacts formed in such a way that allows them
to clamp onto the edges of a defective chip and/or capacitor. The spring rate of
the clips allows them to cling to the device without slipping and yet not damage
the device. The clip rod slides through the attached clip and is positioned onto
the notches in the sides of the support base. The sides of the support base are
designed so that when the rod is placed in the notches, the reworked substrate is
suspended off the bottom surface of the base.
Several substrates can be reworked with the same tool. When the tool is
fully loaded with substrates, it is sent through the chip joining furnace which
causes the solder joint to reflow. As the solder reflows, the weight of the
substrate causes it to drop to the bottom surface of the base. However, the
device clip clings to the defective device and forces it to separate from the
substrate. When the tool exits the furnace, the defective device is suspended
from the rod while the substrate is sitting on the bottom with a void device site,
ready for a new device, as shown in Fig. 2. The solder pads on the void device
site do not require any further reworking for a new device placement.