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Handling Mechanism for Ceramic Wafers

IP.com Disclosure Number: IPCOM000070107D
Original Publication Date: 1978-Aug-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue

IBM

Related People

Authors:
Arnold, WA Bouchard, DR Pockette, WW Webster, RF [+details]

Abstract

Ceramic substrates are mechanically moved from holding tray 25 down path 26 to slot 32. At slot 32 the substrates are placed on a rotatable head 20 which has eight positions thereon. Head 20 is rotated one position by motor 31 after each substrate is picked up. After four such rotations, the substrate arrives at exposure station 21, where it is exposed in a conventional manner by exposure mechanism 35. Exposed substrates are removed at slot 32 from head 20 into a tray 27 by positioned exposed substrates.