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Elimination of Wafer Warpage in Large Diameter Silicon Wafers

IP.com Disclosure Number: IPCOM000070126D
Original Publication Date: 1978-Aug-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue

IBM

Related People

Authors:
Gaind, AK Hearn, EW Schwuttke, GH [+details]

Abstract

Where thermal gradients in hot processing are minimized in semiconductor device manufacture, the films placed on the front and back wafer surfaces control the direction and magnitude of the elastic warpage.