Browse Prior Art Database

Elimination of Wafer Warpage in Large Diameter Silicon Wafers Disclosure Number: IPCOM000070126D
Original Publication Date: 1978-Aug-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue


Related People

Gaind, AK Hearn, EW Schwuttke, GH [+details]


Where thermal gradients in hot processing are minimized in semiconductor device manufacture, the films placed on the front and back wafer surfaces control the direction and magnitude of the elastic warpage.