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Flip Chip Terminal for Semiconductor Devices

IP.com Disclosure Number: IPCOM000070129D
Original Publication Date: 1978-Aug-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue

IBM

Related People

Authors:
Jadus, DK [+details]

Abstract

The thermal resistance of PbIn or PbSn flip-chip solder balls to the Si is decreased by placing the Pb(In, Sn), CrCuAu, AlCu(Si) in contact with Si.