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Chip Temperature Measurement During Manufacture

IP.com Disclosure Number: IPCOM000070200D
Original Publication Date: 1978-Aug-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue

IBM

Related People

Authors:
Cammarano, AS Elliott, DK Hinderer, JJ [+details]

Abstract

The actual temperature of a chip can be measured during the chip joining process if externally accessible wires are bonded to opposite ends of an aluminum stripe on a chip.