Browse Prior Art Database

Detachable Boiling Heat Sink

IP.com Disclosure Number: IPCOM000070204D
Original Publication Date: 1978-Aug-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue

IBM

Related People

Authors:
Simons, RE [+details]

Abstract

A multi-chip heat sink mechanism is provided which increases the thermal performance without excessive chip loading, and is removable so as not to impact chip manufacturing handling.