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A multi-chip heat sink mechanism is provided which increases the thermal performance without excessive chip loading, and is removable so as not to impact chip manufacturing handling.
English (United States)
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Detachable Boiling Heat Sink
A multi-chip heat sink mechanism is provided which increases the thermal
performance without excessive chip loading, and is removable so as not to
impact chip manufacturing handling.
The mechanism consists of a multiplicity of boiling studs 10, one for each
chip 12 in the LEM (liquid-encapsulated module). All the studs 10 are mounted
through a pressure plate 11, which is fixed to the LEM case 13 by mounting
posts 14. Each stud 10 is spring-loaded by spring 15 so as to butt up against a
chip 12. Each stud 10 has an indium tip 16 which bears against the chip surface.
Under spring loading and the temperature increase, the indium will creep and
provide intimate contact between the chip 12 and stud 10.
In operation, heat is transmitted from the chip 12 to the stud 10 via
conduction, and from the stud 10 to the liquid via boiling. Boiling occurs along the
stud 10 on both sides of pressure plate 11. Exit ports 18 are provided in the
pressure plate 12 to allow for vapor flow to the LEM fins 20. Retainer clips 22
are provided for each stud 10 so that they will not fall off the pressure plate 12
when the cooling cap 13 is not joined to the substrate 24. No permanent chip 12
to heat sink 10 connection is made; detachment of the heat sink 10 from the chip
12 occurs when the LEM cap 13 is removed from the substrate 24.
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