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Intramodular Thermal Shunt

IP.com Disclosure Number: IPCOM000070205D
Original Publication Date: 1978-Aug-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue

IBM

Related People

Authors:
Goodman, HA [+details]

Abstract

The device 9 lowers the internal thermal resistance of a circuit module, thereby increasing the rate at which heat generated by the circuit chip 15 can be removed. The shunt consists of a piece of thermally conductive material formed into the shape shown in Fig. 1 and comprised of a flat, rectangular portion 11 at the center, with a pair of diverging wings 12 and 13 emanating from opposite sides. The rectangular center 11 is of sufficient size to completely cover the circuit chip with which it is used and, additionally, may have a thickness greater than that of the wings both to help maintain the flatness required for maximum surface contact with the surface of the circuit chip and to provide a better thermal conduction path.