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Single Step "Lift Off" of Resists Disclosure Number: IPCOM000070226D
Original Publication Date: 1978-Aug-01
Included in the Prior Art Database: 2005-Feb-21

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Carothers, JA Economy, J Gritter, RJ Ouano, AC [+details]


The current metallization process in the manufacture of large scale integrated circuits involves the use of multiple lithographic coating and development techniques. This adds to the manufacturing cost and reduces yield. We have found that soaking an exposed photoresist with a trialkylamine prior to image development results in a significant "over-hang" in the image profile which makes this process ideal for the single step "lift off" process. In the conventional lithographic process the image profile of the developed pattern does not show the "over-hang" structure.