Browse Prior Art Database

Chip Removal and Substrate Rework Tool

IP.com Disclosure Number: IPCOM000070239D
Original Publication Date: 1978-Aug-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue

IBM

Related People

Authors:
Mathers, MR Muller, JB [+details]

Abstract

The tool 10, suitable for removing a single bubble chip from a module containing a plurality of chips or for removing solder from a chip site, consists of a base plate 11 which supports and precisely locates the substrate holder 12 and the top plate 13. The top plate 13 serves as a mount for either one of two inserts, the wrench 14 for chip removal and the chisel 15 for site preparation. Items 11, 12 and 13 are designed to locate the inserts precisely in relation to the substrate and to limit their motion as required by the geometry of the module.