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Self Aligned Double Lift Off Process

IP.com Disclosure Number: IPCOM000070304D
Original Publication Date: 1978-Sep-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue

IBM

Related People

Authors:
Geffken, RM Motsiff, WT [+details]

Abstract

This lift-off technique enables a self-aligned sealed structure to be deposited using only a single-mask alignment step. A deposited structure results which has its edges sealed by a second deposited layer which can be used, for example, as a passivation layer. Use of the technique enables the use of materials which are normally not self-passivating to be used in high-density integrated circuits where mask alignment is critical.