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Selective Staining Method for Studying Polishing Pads

IP.com Disclosure Number: IPCOM000070336D
Original Publication Date: 1978-Sep-01
Included in the Prior Art Database: 2005-Feb-21

Publishing Venue

IBM

Related People

Authors:
Mendel, E [+details]

Abstract

Silicon wafer polishing pad structure is delineated and contamination particles are detected for pad inspection by the use of basic dyes.