Contamination Mapping and Sizing Technique for Blank Semiconductor Wafers
Original Publication Date: 1978-Sep-01
Included in the Prior Art Database: 2005-Feb-21
This technique addresses problems associated with locating and sizing particles which are invisible to the naked eye on blank (unpatterned) wafers via microscopic inspection. There are automatic image analyzing systems which can inspect blank wafers for particle defects; however, they are expensive and slow because the whole wafer surface must be scanned. Sizing the particle on the unpatterned wafer is also time consuming since a filar eyepiece must be used.