Browse Prior Art Database

Enhancing Plated Copper Adhesion

IP.com Disclosure Number: IPCOM000080923D
Original Publication Date: 1974-Mar-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Authors:
Ameen, JG Ellis, TL Elmore, GV [+details]

Abstract

A one-mil transfer film of PYRALUX* "B" stage resin adhesive removably coated on a MYLAR* polyester or KPATON* polyimide backing is cured concurrently with the resin prepregs to provide, on a printed-circuit product or the like, a surface to which copper will readily adhere when applied by additive processes (e.g., electroless processing alone, or electroless followed by electrolytic processing).