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Thick Photoresist Layer Production Disclosure Number: IPCOM000089516D
Original Publication Date: 1977-Nov-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

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Thick Photoresist Layer Production

Thick (</= 20 Microns) photoresistor layers are produced by means of a heated rotatable wafer chuck.

An appropriate quantity of the photoresist is applied to a substrate supported on a heated rotatable wafer chuck of spin table where it is left for a while and finally spun. The thickness obtained is essentially a function of the substrate temperature, the time the photoresist is left on the wafer chuck and the spinning speed.