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After a chip is mounted on a lead frame, a repair is reported for recovering the chip or lead frame any phase of the chip-mounting process prior to of the chip on the frame by molding.
English (United States)
This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately
89% of the total text.
Chip/Tape or Tape/Lead Frame Delamination Technique
After a chip
is mounted on a lead frame, a repair is
reported for recovering the chip or lead frame any phase of the
chip-mounting process prior to of the chip on the frame by molding.
assembly process, a chip and lead frame are fastened
together prior to wire bonding by an adhesive tape decal between the
chip and lead Current assembly methods used to mount a chip on a
frame for a dual-in-line (DIP) package do not provide a method for
the chip or lead frame should that be In the prototype phase of a
development program in where parts are valued at a premium, recovery
is should a chip be misaligned on the frame, or malfunctioning. If
chip recovery is attempted stripping a chip from a tape decal and
lead frame the chip is usually cracked or chipped around the
To recover a
chip or lead frame at any point prior to
delamination technique, the chip/lead frame is placed in a heat
transfer clamp with a feature and secured, as shown in the Heat is
applied to the fixture when chip recovery is or to the lead frame
when lead frame recovery is Heat is transferred to the tape interface
requiring and spring tension is applied to the lead members to cause
a peel force across the chip/tape or frame interface to cause
recovery is desired, heat is applied to the and is
transferred through the chip to the chip/tape By raising a movable
jaw, a slight upw...