Browse Prior Art Database

Chip/Tape or Tape/Lead Frame Delamination Technique

IP.com Disclosure Number: IPCOM000099323D
Original Publication Date: 1990-Jan-01
Included in the Prior Art Database: 2005-Mar-14
Document File: 2 page(s) / 73K

Publishing Venue

IBM

Related People

Authors:
Bosley, RC Chase, J Hatch, PE Phelps, DW Starr, SG [+details]

Abstract

After a chip is mounted on a lead frame, a repair is reported for recovering the chip or lead frame any phase of the chip-mounting process prior to of the chip on the frame by molding.